MIL-PRF-31032/5 (W/AMENDMENT 1)
时间:2024-05-18 21:27:18 来源: 标准资料网 作者：标准资料网 阅读：8071
MIL-PRF-31032/5 (W/AMENDMENT 1), PERFORMANCE SPECIFICATION SHEET: PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOPLASTIC OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL, WITH PLATED THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS (10 MAR 2009)., This specification covers the generic performance requirements for rigid, multilayered (three or more conductor layers) printed wiring boards (hereafter designated printed board) with plated holes, constructed of thermoplastic base materials, that will use soldering for component/part mounting (see 6.1.1). Mixed base material printed boards containing both thermoplastic and thermosetting resin base materials are also covered. The printed board may contain an internal metal core or external heat sink.
基本信息
| 标准名称： | 小型组合冲模 宽60拼合凹模 |
| 中标分类： |
航空、航天 >>
航空器与航天器制造用设备 >>
模具 |
| ICS分类： |
机械制造 >>
无屑加工设备 >>
模制设备和铸造设备
|
| 发布日期： | 1983-08-25 |
| 实施日期： | 1983-09-01 |
| 首发日期： | |
| 作废日期： | |
| 出版日期： | |
| 页数： | 1页 |
适用范围
没有内容
前言
没有内容
目录
没有内容
引用标准
没有内容
所属分类： 航空 航天 航空器与航天器制造用设备 模具 机械制造 无屑加工设备 模制设备和铸造设备
Product Code:SAE AMSQQP416
Title:Plating, Cadmium (Electrodeposited)
Issuing Committee:Ams B Finishes Processes And Fluids Committee
Scope:This specification covers the requirements for electrodeposited cadmium plating.Cadmium plating shall be of the following types and classes, as specified (See 6.2):I-As platedII-With supplementary chromate treatment (See 3.2.8.1)III-With supplementary phosphate treatment (See 3.2.8.2)1 - 0.0005 inch, minimum2 - 0.0003 inch, minimum3 - 0.0002 inch, minimum